TECH

Sources: SK Hynix to select a US site for its chip packaging plant, which would qualify for CHIPS Act funding, by Q1 2023 and enter mass production by 2025-2026 (Alexandra Alper/Reuters)


Alexandra Alper / Reuters:

Sources: SK Hynix to select a US site for its chip packaging plant, which would qualify for CHIPS Act funding, by Q1 2023 and enter mass production by 2025-2026  —  South Korea’s SK Hynix aims to select a U.S. site for its advanced chip packaging plant and break ground there around …



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